Solid surfaces are cooled Directly (such as aluminium walls of a small enclosure or surface of a processor) and the heat is dissipated to the Air in the surroundings.

Pros – TE technology

• Compact solutions possible

• Can be installed in any position

• Solid state design offers reliability and ruggedness

• Cooling & heating

• Accurate temp control easy to achieve

• Easy to design in almost any shape

• Environmentally friendly

Air to Plate Item#		ATP200-24VDC
Cooling Capacity(W)		195
Current(A)		15.6
Voltage(VDC)		24
Weight(kg)		5.9
Dimension (mm) (Cold side)	Length	350
	Width	150
	Height	27
Dimension (mm) (Hot side)	Length	400
	Width	180
	Height	103

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